NDT- INDONESIA.COM
Indonesia |
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| X-ray Examination Equipment / X-Ray PCB Alignment Equipment: XA090-P1 |
(Product Photo) |
| | Introduction to the Product :
XA090-P1 is equipment that automatically executes precision alignment and cohesion.
Between layers of boards including Stack Via, Nero Manhattan Bump Interconnection.
( NMBI) , Flip-Chip and BGA board which are cutting edge PCB manufacturing
technique.
Now you can experience more efficient product manufacturing with equipment
appropriate for manufacturing technology of advanced engineering.
Applicable subjects:
- Stack via PCB, NMBI ( Neo Manhattan Bump Interconnection) PCB
- Board for Flip-Chip application
- Board for BGA application
Main Features:
- High precision alignment function ( Resolution : 2§ )
- Mark inspection simulation function
- Manufacturing management / statistics management
- Precision automated calibration function
- Uses closed-tube for which maintenance is convenient
- Measurement for quality management / Provision of analysis program | | |
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| Origin: | China |
| Price: | Kompetitif |
| Quantity: | Satuan atau lebih |
| Pack. & Delivery: | Sesuai pesanan |
Your inquiry will be recorded in "Member Trade Mail". |
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