 NDT- INDONESIA.COM Indonesia |
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| Products Catalog: X- ray Examination Equipment / X- Ray PCB Alignment Equipment: XA090- P1 |
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| Specification: | Introduction to the Product :
XA090- P1 is equipment that automatically executes precision alignment and cohesion.
Between layers of boards including Stack Via, Nero Manhattan Bump Interconnection.
( NMBI) , Flip- Chip and BGA board which are cutting edge PCB manufacturing
technique.
Now you can experience more efficient product manufacturing with equipment
appropriate for manufacturing technology of advanced engineering.
Applicable subjects:
- Stack via PCB, NMBI ( Neo Manhattan Bump, Interconnection) PCB,
- Board for Flip- Chip application,
- Board for BGA application
Main Features:
- High precision alignment function ( Resolution : 2§ )
- Mark inspection simulation function
- Manufacturing management / statistics management
- Precision automated calibration function,
- Uses closed- tube for which maintenance is convenient,
- Measurement for quality management / Provision of analysis program . |
Your inquiry will be recorded in "Member Trade Mail". |
Recommend to your friends |
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